Home > Company History > Key Advantages

• Semiconductors- Developed custom CMP polishing slurries for oxides, copper, SiC and GaN-High removal rates, low nonuniformity and low defectivity
• Paper- Antiskid, Printable anti-skid and frictionizers for corrugated, boxes and liner boards providing high slide angles and low misting; retention aids for paper manufacture
• Coatings- Silica nanoparticle dispersions in water and organic solvents for high strength coatings with scratch and mar resistance
• Catalysts- ultra-pure colloidal silicas for binders and pure silica source
• Chromatography- spherical silica particles with unimodal size distributions and low metals content

• Ultra-high purity- ppb level of contaminating metals
• Unimodal particle distribution; can blend sizes for desired distributions
• Able to make a much denser particle then currently on the market as well as customize the porosity of the particle
• Spherical particles

• Fully automated production and pilot line – newest, most contemporary, and most automated silica production facility in North America
• 15 years designing colloidal silica process – proprietary manufacturing and purification process
• Full SPC controlled process that monitors and logs over 35+ critical functions in the process
• No contamination in process – no boilers/steam which cause contaminants –
  all process equipment is stainless steel, plastic or PTFE
• Exceptional consistency and purity – very low metals
• Everything leaving plant filtered through at least 1 micro filters
• Raw material suppliers local and secure
• 1 day max order to delivery
• ISO 9001 and 14001 in process
• Analytical and process development laboratories
• Any packaging type
• 24/7 customer service

We want to sell the customer what they want and need; therefore we can customize the product to meet most any specifications.

Our goal is to be world class in all the things we do.