Home > Products > Electronic

Introduction
Product Documentation
Products Available
Silco EM-1530HP
Silco EM-510
Silco EM-2530HP
Silco EM-2530K
Silco EM-3530HP
Silco EM-5530HP
Silco EM-5530K
Silco EM-7530A
Silco EM-7530K
Polishing Silicon Carbide
Shipping and Handling

Introduction

• Division of Silco International Inc.; subsidiary of Fluid Logic LLC
• Offering Highest Quality CMP Slurry products for semiconductor manufacturing
• Fully automated production and pilot-scale facilities
• CMP Slurry reclaim capabilities
• CMP Slurry Leasing options

Product Documentation

• Silco Presentation for EM (PDF)
• Oxide Polish Literature Sheet (PDF)
• Wafer Polish Literature Sheet (PDF)

Products Available

Colloidal Silica for Precision Polishing

• KOH, Ammonia, Peroxide, other solutions
• Average Particle Size choices 5 - 95 nm
• Colloidal Silica for Copper CMP
• Low pH colloidal silica for Metal Polish
• Custom Slurry Formulations – Mixed PSD’s
• Embedded Metal or Metal Oxide nanoparticles

EM-1530HP

Silco EM-1530HP Colloidal Silica is specifically designed for CMP processing of silicon wafers where precise and consistent removal rates are required to minimize scratch and particle defects while maximizing planarity across the wafer surface.  It is typically supplied with a average particle size of 25 nanometers having a 20% solids concentration in a low pH solution, although other custom formulations are also available.  All CMP slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.

Typical Properties:

EM-510

Silco EM-510 Silicon Polish is a high purity colloidal silica product specifically designed for silicon wafer polish applications where precise and consistent removal rates are required with minimal defects and maximum planarity across the wafer surface.  It is typically supplied with a average particle size of 50 nanometers having a 10% solids concentration in an ammonium hydroxide solution, although other custom formulations are also available.  All Silco EM slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.

Typical Properties:

Silco EM-2530HP

EM-2530HP is specifically designed for the most demanding CMP applications where precise and consistent removal of copper and barrier layers is needed along with minimal added defects. It is typically supplied with an average colloidal silica particle size of 25 nanometers having a 30% solids concentration in a low pH solution, although other custom formulations are also available. All Silco EM slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.

Typical Properties:

Silco EM-2530K

Silco EM-2530K Collodical Silica is specifically designed for CMP processing of Copper layers where precise and consistent removal rates are required to minimize scratch and particle defects while maximizing planarity across the wafer surface.  It is typically supplied with a average particle size of 25 nanometers having a 30% solids concentration in a KOH solution, although other custom formulations are also available.  All Silco EM slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.

Typical Properties:

Silco EM-3530HP

EM-3530HP is specifically designed for advanced CMP processing of bulk copper and copper barrier layers where high purity is required to achieve minimal defectivity. The exceptionally high quality of these monodisperse particles provides excellent removal rates and maximum planarity across the entire wafer surface. EM-3530HP is typically supplied with an average particle size of 35 nanometers at a 30% solids concentration in a stable low-pH solution, although other custom formulations are also available. All Silco EM slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.

Typical Properties:

Silco EM-5530HP

EM-5530HP is specifically designed for CMP processing of metal layers where precise and highly consistent removal rates are required. EM-5530HP will provide minimal scratch and particle defects while maximizing planarity across the wafer surface. It is typically supplied with an average particle size of 55 nanometers having a 30% solids concentration in a stable low pH solution, although other custom formulations are also available. All Silco EM slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.

Typical Properties:

Silco EM-5530K

Silco EM-5530K is specifically designed for exceptional CMP processing of advanced Low-K dielectric layers where precise and consistent removal rates are required, along with absolute minimal defectivity, while achieving maximum planarity across the wafer surface. It is typically supplied with an average particle size of 55 nanometers and having a 30% solids concentration in a pH-stable KOH solution, although other custom formulations are also available. All Silco EM slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.

Typical Properties:

Silco EM-7530A

EM-7530A OXIDE POLISH SLURRY is a high purity colloidal silica product specifically designed for CMP applications where precise and consistent removal rates are required to minimize scratch and particle defects while maximizing planarity across the wafer surface.  It is typically supplied with an average particle size of 75 nm having a 30% solids concentration in a NH4OH solution, although other custom formulations are also available.  All CMP slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.000 cleanroom.

Product Specifications:

Silco EM-7530K OXIDE POLISH SLURRY

EM-7530K OXIDE POLISH SLURRY is a high purity colloidal silica product specifically designed for CMP applications where precise and consistent removal rates are required to minimize scratch and particle defects while maximizing planarity across the wafer surface.  It is typically supplied with an average particle size of 75 nanometers having a 30% solids concentration in a KOH solution, although other custom formulations are also available.  All CMP slurry products are packaged in drum or tote containers inside our Class 1000 cleanroom.

Product Specifications:

Shipping and Handling

Silco EM Colloidal Silica is ready for immediate use upon receipt although it may be stored for up to one year if maintained in a controlled temperature environment between 40ºF and 90ºF.  Containers must remain unopened during the storage period. Silco recommends that all CMP slurry products are subjected to a minimum amount of agitation during shipping and storage, also avoid any rapid change in temperature.  Silco CMP slurry products may contain biocide according to customer specifications.

Quality Guarantee:  If you do not see a significant reduction in your wafer defect count using the products above, Silco will gladly refund 100% of your purchase price.